Harsh conditions
Designed to withstand intense heat, high pressure, vibration and a broad range of chemical exposures.
FORTRESON™ structured encapsulation protects mission-critical electronics and the intellectual property at their core.
Explore FORTRESON™FORTRESON™ surrounds critical assemblies with structured encapsulation designed for demanding operating conditions and restricted physical access.
Designed to withstand intense heat, high pressure, vibration and a broad range of chemical exposures.
A hardened protective structure helps shield electronic components against impact and determined mechanical tampering.
A physical barrier makes access to sensitive circuitry and reverse engineering more difficult.
FORTRESON™ can follow the contours of electronics of different shapes and sizes, including existing boards. Its protective approach is relevant wherever electronic survivability and safeguarding proprietary technology are essential.
Extensive testing performed by the University of Western Australia confirms protective capabilities of FORTRESON™ in the conditions tested. The technology is designed to help protect electronics and make access to the intellectual property within more difficult.
Application-specific performance should be assessed against the conditions and requirements of each platform.
Discuss a platform, operating environment or integration requirement with our team.
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